CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) Competition

Subject to the availability of funds, this NOFO seeks applications for industry-informed, university-based artificial intelligence-powered autonomous experimentation (AI/AE) collaborations, including research and development, education and workforce development, and related activities relevant to sustainable

credit:


semiconductor materials and processes.

If successful, awards made under this NOFO will support the long-term viability of next-generation domestic semiconductor manufacturing, accelerating the discovery, design, synthesis, and adoption of materials and processes, and the development of new researchers needed to meet the industry’s technology, economic, and sustainability goals.



Obtain Full Opportunity Text:
https://www.fedconnect.net

Additional Information of Eligibility:
• Under this NOFO, eligible applicants are domestic accredited institutions of higher education and domestic non-profit or for-profit organizations that manage consortia of accredited institutions of higher education.

A domestic entity is one that is incorporated within the United States (including a U. S. territory) with its principal place of business in the United States (including a U. S. territory).

Eligible applicants may submit only one concept paper and, if invited, one full application.

• Eligible subrecipients under this NOFO include accredited institutions of higher education; for-profit organizations or non-profit organizations; State, local, territorial, and Tribal governments; Federally Funded Research and Development Centers; Federal entities; foreign partners; and other entities eligible to participate as applicants.

Eligible subrecipients may participate in multiple applications.• Vendors selling goods or services in the ordinary course of business are not considered subrecipients under this NOFO.

Full Opportunity Web Address:
https://www.fedconnect.net

Contact:


Agency Email Description:
Agency Contact

Agency Email:


Date Posted:
2024-10-30

Application Due Date:


Archive Date:
2025-02-12



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