Wafer Scale Infrared Detectors (WIRED)
DARPA is soliciting research proposals to develop novel technologies for infrared sensors.
The WIRED program seeks to provide high-performance, low-cost infrared imagers that respond in the short wave infrared (SWIR) and mid wave infrared (MWIR), and that can be fabricated directly on silicon-based readout integrated circuit (ROIC) substrates at the wafer scale.
Also of interest are innovative approaches to high temperature long wave infrared (LWIR) detectors that directly measure photocurrent.
The WIRED program seeks to provide high-performance, low-cost infrared imagers that respond in the short wave infrared (SWIR) and mid wave infrared (MWIR), and that can be fabricated directly on silicon-based readout integrated circuit (ROIC) substrates at the wafer scale.
Also of interest are innovative approaches to high temperature long wave infrared (LWIR) detectors that directly measure photocurrent.
Agency: Department of Defense
Office: Defense Advanced Research Projects Agency
Estimated Funding: Not Available
Office: Defense Advanced Research Projects Agency
Estimated Funding: Not Available
Obtain Full Opportunity Text:
MTO Solicitations Page
Additional Information of Eligibility:
Not Available
Full Opportunity Web Address:
http://www.darpa.mil/work-with-us/opportunities/Solicitations/DARPA_Solicitations?tFilter=&oFilter=5&sort=name
Contact:
Dr. Jay LewisProgram Manager
Agency Email Description:
BAA Coordinator
Agency Email:
DARPA-BAA-15-57@darpa.mil
Date Posted:
2015-09-10
Application Due Date:
2015-11-23
Archive Date:
2016-05-31
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