Magnetic Miniaturized and Monolithically-Integrated Components (M3IC)

The DARPA Microsystems Technology Office is soliciting innovative research proposals to develop integrated magnetic components on semiconductor substrates that will reduce size and enable new functionality for U. S. Department of Defense (DoD) electromagnetic (EM) systems.

Proposals will focus


on one or more of the following technical areas:
1) integration of magnetic components on semiconductor substrates, 2) modeling the system-level impact of nonlinear, non-reciprocal, time-dependent magnetic phenomena, and 3) optimization of miniaturized microwave magnetic components.

Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
Related Programs

Research and Technology Development

Department Of Defense


Agency: Department of Defense

Office: Defense Advanced Research Projects Agency

Estimated Funding: $26,000,000


Who's Eligible


Relevant Nonprofit Program Categories



Obtain Full Opportunity Text:
DARPA Solicitations Page

Additional Information of Eligibility:
Not Available

Full Opportunity Web Address:
http://www.darpa.mil/work-with-us/opportunities

Contact:
Dr. William D. PalmerDARPA Program Manager

Agency Email Description:
BAA Coordinator

Agency Email:
DARPA-BAA-16-36@darpa.mil

Date Posted:
2016-06-16

Application Due Date:
2016-08-01

Archive Date:
2016-08-31



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