Defense Production Act (DPA) Title III 3D Microelectronics for Information Protection Program
The objective of this DPA Title III Project is to expand existing domestic supplier production capabilities to produce three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications.
The focus of this effort shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD supplier of 3D microelectronics modules incorporating Information Protection.
The quality of ultra-high density modules produced throughout this effort will be verified against current industry standards; quality verification efforts will include production and testing of the 3D ultra-high density microelectronics modules.
The focus of this effort shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD supplier of 3D microelectronics modules incorporating Information Protection.
The quality of ultra-high density modules produced throughout this effort will be verified against current industry standards; quality verification efforts will include production and testing of the 3D ultra-high density microelectronics modules.
Obtain Full Opportunity Text:
Not Available
Additional Information of Eligibility:
Not Available
Full Opportunity Web Address:
Contact:
Dianna AnitonAgreements OfficerPhone 937-713-9897
Agency Email Description:
For Questions & Assistance
Agency Email:
dianna.aniton@us.af.mil
Date Posted:
2016-06-15
Application Due Date:
2016-08-08
Archive Date:
2016-08-31
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