Low Temperature Logic Technology (LTLT)
The DARPA Microsystems Technology Office is soliciting research proposals for the development of low temperature (77K) FinFET technology to achieve a 25X improvement in the performance/power of state-of-the-art (SOA) central processing units (CPU) compared to room temperature (RT) operation.
Agency: Department of Defense
Office: DARPA - Microsystems Technology Office
Estimated Funding: $19,000,000
Office: DARPA - Microsystems Technology Office
Estimated Funding: $19,000,000
Obtain Full Opportunity Text:
Beta.SAM Contract Opportunities
Additional Information of Eligibility:
All responsible sources capable of satisfying the Government's needs may submit a proposal that shall be considered by DARPA.
See the Eligibility Information section of the BAA for more information.
Full Opportunity Web Address:
https://beta.sam.gov/opp/110fc53cc3274eb4a7af78299ad2186c/view
Contact:
Agency Email Description:
dnengomasha@usaid.gov
Agency Email:
Date Posted:
2021-03-10
Application Due Date:
Archive Date:
2021-11-30
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