CHIPS Incentives Program – Commercial Fabrication Facilities
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U. S. economic and national security.
This is the first Notice of Funding Opportunity under this program.
It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors.
For more information, additional resources, and instructions on how to apply, please visit chips.gov.
Note that all applications must be submitted through the CHIPS Incentives Portal at http://applications.chips.gov.
If you have any questions on how to apply, please email apply@chips.gov.
This is the first Notice of Funding Opportunity under this program.
It seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors.
For more information, additional resources, and instructions on how to apply, please visit chips.gov.
Note that all applications must be submitted through the CHIPS Incentives Portal at http://applications.chips.gov.
If you have any questions on how to apply, please email apply@chips.gov.
Agency: Department of Commerce
Office: National Institute of Standards and Technology
Estimated Funding: $550,000,000
Office: National Institute of Standards and Technology
Estimated Funding: $550,000,000
Obtain Full Opportunity Text:
CHIPS Application portal
Additional Information of Eligibility:
An applicant must be a “covered entity” to receive CHIPS Incentives.
For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, or production of semiconductors.
Full Opportunity Web Address:
http://applications.chips.gov
Contact:
Agency Email Description:
Agency Contact
Agency Email:
Date Posted:
2023-02-28
Application Due Date:
Archive Date:
2023-06-30
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